Employees at HIC JSC have many years of experience in thick-film technologies and surface-mount assembly of electronic components.

In January 1997, we developed and implemented a quality management system, which was certified on May 13, 1997, as compliant with the international ISO 9001 standard.

The majority of our production (about 90%) — hybrid integrated circuits, resistor networks, high-voltage resistors, PCB modules, and microchip modules — is exported to Western Europe.

Highly qualified designers develop circuit topologies and photomasks using modern software tools.

The production cycle for hybrid ICs begins with screen printing of conductive, dielectric, resistive, and passivation layers onto a ceramic substrate. Using automatic screen-printing machines, each layer is applied as a thick-film composition and then dried. Resistor networks, high-voltage resistors, and multilayer hybrid structures are formed after firing in conveyor ovens under strictly controlled temperature profiles.

Integral resistors formed by screen printing are precisely trimmed to their nominal value using lasers. Laser systems are also used for scribing (cutting) ceramic substrates and drilling through-holes in them.

A wide range of active and passive SMD components are mounted using high-speed surface-mount machines and then soldered either in an infrared conveyor reflow oven or by wave soldering.

All products undergo visual inspection at every production stage. Final inspection, including electrical and functional tests, is performed according to the specific requirements of each client.

Our work is individualized to meet the requirements of our customers. We serve multiple market sectors, offering competitive prices, short lead times, high quality, and reliability.

Inquiries and orders are processed promptly, and clients can receive comprehensive information about their products at every stage of production.