HICs - Хибридни Интегрални Схеми АД

Thick-Film Hybrid Integrated Circuits (HICs)

One of our core activities is the design and production of thick-film hybrid integrated circuits (HICs).
A hybrid integrated circuit (HIC) is a type of electronic circuit that combines multiple components on a single ceramic substrate. This technology offers great flexibility in circuit design. Thick-film hybrids are highly resistant to various environmental influences. The substrate material, Al₂O₃, has two important properties – excellent electrical insulation and high thermal conductivity.

We manufacture passive resistor networks according to customer specifications, and after laser trimming, the desired tolerances and ratios between the resistors specified by the client can be achieved.

0.1Ω -1 Ω ±5%
1Ω -10 Ω ±1%
10Ω -100kΩ ±0.5%
100kΩ -10MΩ ±1%
10MΩ - 99MΩ ±5%

Population with SMD components (active and passive) to create a complete electronic module. After component assembly, functional adjustments can be performed using voltage, current, or frequency.

Hybrid modules can be equipped with leads:

Pitch of 2.54 or 1.27 mm
SIL – single-row arrangement
DIL – double-row arrangement
Or custom arrangements according to customer requirements

They can also be protected by coating, or by placement and encapsulation in a plastic or metal enclosure.

Thick-film hybrid technology can be used wherever high reliability under harsh conditions is required and where high thermal conductivity is important:

Sensor Technology
High-Vacuum Applications
Power Electronics
High-Frequency Circuits (antenna amplifiers up to 10 GHz)
Measurement and Control Equipment
Aerospace and Telecommunications
Automotive Electronics (injection electronics, brake system electronics, engine electronics)